Aiming to meet rising demand for on-device AI, Samsung Electronics has begun mass production for the industry’s thinnest dynamic random access (DRAM) low-power memory chips.
Samsung said it is producing chisp in 12-nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages. The devices are as thin as a fingernail, and it’s an example of how AI is driving demand for new kinds of electronics.
Leveraging its expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.
“Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, EVP of memory product planning at Samsung Electronics, in a statement. “We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”
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With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure1, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping3 process is also used to minimize the package height.
Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continue to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.