
E6 Claims Its Groundbreaking Copper-Diamond Heatsinks Will Keep Chips Chill
Element Six (E6), a subsidiary of the ever-dominant De Beers Group, just put out a press release unveiling its new “Copper Diamond Composite Material” (Cu-Diamond composite), a material it claims can revolutionize cooling solutions for high-performance computing (HPC) chips and GaN RF devices. This shiny innovation promises high thermal and electrical conductivity while also being—according to E6—a “cost-effective solution.” So, why copper and diamond? Copper is already a workhorse for thermal and electrical conductivity, while