NVIDIA and AMD have reserved all of TSMC’s CoWOS and SoIC advanced packaging for 2024 and 2025
AMD and NVIDIA are both pumping out new generations of AI hardware, with the two GPU giants eating all of TSMC’s advanced packaging capacity for not just 2024, but also 2025. 2 VIEW GALLERY – 2 IMAGES In a new report from UDN, the site reports that TSMC will contract advanced packaging production capacity of its in-house CoWoS and SoIC for this and next year, as AI GPU hardware orders aren’t slowing down. TSMC expects